article · Advanced Materials · 2020

3D Microelectronics: 3D Self‐Assembled Microelectronic Devices: Concepts, Materials, Applications (Adv. Mater. 15/2020)

Daniil Karnaushenko, Tong H. Kang, Vineeth Kumar Bandari, Feng Zhu, Oliver G. Schmidt

Cited by 3Abstract and details only

Abstract

Future microelectronics will utilize 3D space offering higher performance, high density, and novel features. In article number 1902994, inspired by natural selfassembly processes, Daniil Karnaushenko, Feng Zhu, Oliver G. Schmidt, and co-workers provide a vision as to how 3D microelectronics should be developed in the near future. History as well as the current state of art are reviewed for microelectronic devices pointing at novel monolithic wafer scale self-assembly methods explored for rolled-up, polygonal, and pop-up microelectronics.

Cite this paper

APA 7

Karnaushenko, D., Kang, T. H., Bandari, V. K., Zhu, F., & Schmidt, O. G. (2020). 3D Microelectronics: 3D Self‐Assembled Microelectronic Devices: Concepts, Materials, Applications (Adv. Mater. 15/2020). Advanced Materials, 32(15). https://doi.org/10.1002/adma.202070120

MLA 9

Karnaushenko, Daniil, et al. “3D Microelectronics: 3D Self‐Assembled Microelectronic Devices: Concepts, Materials, Applications (Adv. Mater. 15/2020).” Advanced Materials, vol. 32, no. 15, 2020, https://doi.org/10.1002/adma.202070120.

Chicago

Karnaushenko, Daniil, Tong H. Kang, Vineeth Kumar Bandari, Feng Zhu, and Oliver G. Schmidt. 2020. “3D Microelectronics: 3D Self‐Assembled Microelectronic Devices: Concepts, Materials, Applications (Adv. Mater. 15/2020).” Advanced Materials 32 (15). https://doi.org/10.1002/adma.202070120.

Harvard

Karnaushenko, D. et al. (2020) ‘3D Microelectronics: 3D Self‐Assembled Microelectronic Devices: Concepts, Materials, Applications (Adv. Mater. 15/2020)’, Advanced Materials, 32(15). Available at: https://doi.org/10.1002/adma.202070120.

BibTeX

@article{karnaushenko2020microelectronics,
  title = {{3D Microelectronics: 3D Self‐Assembled Microelectronic Devices: Concepts, Materials, Applications (Adv. Mater. 15/2020)}},
  author = {Karnaushenko, Daniil and Kang, Tong H. and Bandari, Vineeth Kumar and Zhu, Feng and Schmidt, Oliver G.},
  journal = {Advanced Materials},
  volume = {32},
  number = {15},
  year = {2020},
  doi = {10.1002/adma.202070120}
}

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