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About 5,982 papers for “Electromigration”

Electromigration

Gary H. Bernstein, A.M. Kriman · Wiley Encyclopedia of Electrical and Electronics Engineering · 1999

Abstract The sections in this article are Metallic Grain Effects The Role of Stress Microscopic Effects Statistical Considerations Managing Electromigration

Cited by 2

Electromigration

Inna Partin-Vaisband, Renatas Jakushokas, Mikhail Popovich et al. · 2016

Cited by 0

Electromigration Techniques

Bogusław Buszewski, Ewelina Dziubakiewicz, Michał Szumski · Springer series in chemical physics · 2013

Cited by 39Open access

Electromigration-aware design

Mircea R. Stan, Paolo Re · 2009

The most common wearout phenomena that impact reliability are: metal electromigration (EM), time-dependent dielectric breakdown (TDDB), hot carrier induced damage (HCID), negative bias temperature instability (NBTI) and thermal cycling. This paper focuses on electromigration and proposes two novel solutions. The first is the use of routing (or slotted) vias for improving electromigration performance for dual damascene copper interconnect without increasing the lateral dimensions of the wires. The second is the use of electromigration ldquoreliability sensorsrdquo in order to detect impending failure of interconnect. The proposed solutions show good results in simulations and measurements of test structures.

Cited by 4

Electromigration: A Review

Matthew S. Francis, Daniel E. Otzen, Blaise Boles et al. · 1997

(2015) Mycobacterial tlyA gene product is localized to the cell-wall without signal sequence. Front. Cell. Infect. Microbiol. 5:60. doi: 10.3389/fcimb.2015.00060 Mycobacterial tlyA gene product is localized to the cell-wall without signal sequence

Cited by 0

Electromigration: A Review

Marialuisa G, Christian Geroin, Ro Picelli et al. · 1997

doi: 10.3389/fnhum.2014.00318 Robot-assisted vs. sensory integration training in treating gait and balance dysfunctions in patients with multiple sclerosis: a randomized controlled trial

Cited by 0

Electromigration theory unified

A. Lodder · Springer Link (Chiba Institute of Technology)

\n \nThe starting formula of Bosvieux and Friedel (J. Phys. Chem. Solids, 23 (1962) 123) for the force on an ion in a metal\ndue to an applied voltage is shown to lead to the same description\nas the linear-response approach used in the field since its\nintroduction by Kumar and Sorbello (Thin Solid Films, 25 (1975) 25). By this\nelectromigration theory has become a unified theory. This follows after\naccounting for a treacherous trap term, which at first sight\nseems to be zero. Up to now,\nBosvieux and Friedel claimed to predict a completely screened\ndirect force, which means that only a wind force would be operative.\nIn addition, the amount of screening has been calculated up to\nsecond order in the potential of the migrating impurity,\nusing a finite temperature version of the screening term derived by Sham (Phys. Rev. B, 12 (1975) 3142).\nFor a proton in a metal modeled as a jellium the screening\nappears to be about 15%, which is neither negligible nor\nreconcilable with the old full-screening point of view.\n\n

Cited by 0

Electromigration and adhesion

J. R. Lloyd, Michael Lane, E. Liniger et al. · IEEE Transactions on Device and Materials Reliability · 2005

It has been demonstrated that, in those instances where electromigration-induced mass transport is dominated by interfacial diffusion, the adhesion at the interface where mass transport is primarily taking place is related to the electromigration flux. Furthermore, it is shown that the cohesive energy of the interface is directly related to the activation energy for diffusion.

Cited by 81

Electromigration vs SIR

Mikolaj E. Jozefowicz, N.‐C. Lee · Circuit World · 1993

The IPC‐SF‐818 surface insulation resistance (SIR) test data taken with the use of a variety of halide‐free, no‐clean fluxes are analysed against Bellcore TR‐NWT‐000078 electromigration (EM) test data. Neither test results show correlation with bulk flux resistivity, flux water extract resistivity, flux residue moisture pick‐up, and flux corrosivity without bias. However, in the case of rosin fluxes, the insulation resistance behaviour in both SIR and EM tests is a function of the pH value of fluxes. This phenomenon is more significant in the SIR test. In the case of low‐residue, no‐clean fluxes, only the SIR test displays such a pH dependent relationship. Data suggest that the 50 volts bias voltage used in the SIR test may be responsible for this, and can be explained with a high‐bias‐voltage‐induced electrolysis mechanism which is further promoted by a high pH environment. This failure mechanism is absent in the EM test which utilises 10 volts bias voltage, and probably will not occur under the normal 5 volts application conditions. Overall, the SIR test seems to be more stringent while the EM test appears to be more realistic.

Cited by 4