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About 10,000 papers for “Embedding”

Strong embedding and weak embedding

Tuna Altınel, Alexandre Borovik, Gregory Cherlin · Mathematical surveys and monographs · 2008

Cited by 0

Embedding

Całek, Agnieszka · Jagiellonian University Repository (Jagiellonian University) · 2024

Cited by 0Open access

EMBEDDING

Spinzi, Cinzia Giacinta · AMS Campus - AlmaDL · 2012

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Embedding

C.P. Wong, Jianwen Xu · Kirk-Othmer Encyclopedia of Chemical Technology · 2004

Abstract Advances in electronic technology have had great technological and economic impact on the electronic industry throughout the world. The rapid growth of the number of components per chip, the rapid decrease of device dimension, and the steady increase in IC chip size have imposed stringent requirements not only on IC physical design and fabrication, but also in electronic packaging and embedding. Electronic embedding is one of the most common processes used to encapsulate and protect electronic components. With advances in VLSI technology and multichip modules packaging, embedding of high density packages in electronics has become a challenge. Various polymeric encapsulants are used for embedding these types of electronic components. These materials, such as silicones, silicon‐carbon thermosets, epoxies, polyurethanes, polyesters, polysulfides, and advanced thermoplastics, and their electrical, mechanical, and rheological properties as well as material processes related to molding, potting, casting, and saturation coating processes, are discussed in detail. Furthermore the studies of material curing by differential calorimetry, ftir, and microdielectrometry are described. The development of a novel aluminum‐filled high dielectric composite is detached. Aluminum is a fast self‐passivation and low‐cost metal. The thin passivation layer forms a boundary layer outside of metallic spheres that has dramatic effects on the electrical, mechanical, and chemical behaviors of the resulting composites.

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embedding

2015

Cited by 0

Embedding

Encyclopedic Dictionary of Genetics, Genomics and Proteomics · 2004

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Embedding

Tuấn Đạt · Kaggle · 2024

Cited by 0Open access

Embedding

Claudia Pons, La Plata · 2008

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Embedding

Katsushi Ikeuchi · 2021

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Embedding

The MIT Press eBooks · 2002

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Embedding

Klaus Solberg Söilen · Springer texts in business and economics · 2024

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Embedding

Thiel, W. · Max Planck Digital Library · 1998

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Embedding

National Cancer Institute · Definitions · 2020

Ope n Pe e r Re v ie w on Qe ios Ope n Pe e r Re v ie

Cited by 0Open access

Embedding

Thiel, W. · MPG.PuRe (Max Planck Society) · 1998

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Embedding

Robert Tagliaferro, Brandon Possum, Steven Wilson et al. · 2024

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embedding

2015

Cited by 0

Embedding

C. P. Wong, Paul D'Ambra · Kirk-Othmer Encyclopedia of Chemical Technology · 2000

Abstract Advances in electronic technology have had great technological and economic impact on the electronic industry throughout the world. The rapid growth of the number of components per chip, the rapid decrease of device dimension, and the steady increase in IC chip size have imposed stringent requirements not only on IC physical design and fabrication, but also in electronic packaging and embedding. Electronic embedding is one of the most common processes used to encapsulate and protect electronic components. With advances in VLSI technology and multichip modules packaging, embedding of high density packages in electronics has become a challenge. Various polymeric encapsulants are used for embedding these types of electronic components. These materials, such as silicones, silicon‐carbon thermosets, epoxies, polyurethanes, polyesters, polysulfides, and advanced thermoplastics, and their electrical, mechanical, and rheological properties as well as material processes related to molding, potting, casting, and saturaton coating processes, are discussed in detail. Furthermore the studies of material curing by differential calorimetry, ftir, and microdielectrometry are described.

Cited by 0