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About 10,000 papers for “Microchannel”

Microchannel Simulation

Mohammad Hassan, Omid Asgari, Hadis Hemati · InTech eBooks · 2012

IntroductionIn the current state of fast developing electronic equipment, having high speeds and at the same time high heat generation rates, researchers are trying to find an effective microcooling method.The main problem in the cooling of microdevices is their high heat generation rate in a limited space.In this way, much research has been conducted on the analysis of different novel microcooling methods such as microheat pipes, microjet impingements, microcapillary pumped loops, microelectrohydrodynamic coolers, and microchannel heat sinks.Among the different microcooling devices the microchannel heat sink has been of special consideration due to its capabilities such as high capacity of heat removal.In principle, microchannels can be machined at the back of a substrate of electronic chips and, therefore, can reduce the internal (contact) thermal resistance of the heat sink practically to zero.The cooling rates in such microchannel heat exchangers should increase significantly due to a decrease in the convective resistance to heat transport caused by a drastic reduction in the thickness of thermal boundary layers.The overall excellent potential capacity of such a heat sink for heat dissipation is based on the large heat transfer surface-to-volume ratio of the microchannel heat exchangers.The use of microchannel heat sink was first introduced by Tuckerman and Pease in 1981 [1].Their research was based on an experiment where they showed that high heat rates of 790 W/cm 2 could be removed by microchannel heat sinks.Currently, research in the field of microchannels is going on in three aspects of experimental methods [2,3,4], numerical methods [5,6,7,8], and analytical methods [9,10,11,12].It is well known that the cross-sectional shape of a channel can have significant affect on the fluid flow and heat transfer characteristics in microchannels.Peng and Peterson [13] performed experimental investigations of the pressure drop and convective heat transfer for water flowing in rectangular microchannels, and found that the cross-sectional aspect ratio had significant influence on the flow friction and convective heat transfer in both laminar and turbulent flows.Kawano et al. [14] provided experimental data on the friction and heat transfer in rectangular, silicon based microchannel heat sinks, and more recently Wu and Cheng [15,16] conducted a series of experiments to measure the friction factor and convective heat transfer in smooth silicon microchannels of trapezoidal cross-section.The experimental methods has its own values and the new developments in the micromachining techniques help the researchers to perform precise experiments, but because of its high cost it fails to be commonly applied.www.intechopen.

Cited by 1Open access

Microchannel Simulation

Mohammad Hassan Saidi, Omid Asgari, Hadis Hemati · Contact-less Assessment of In-vivo Body Signals Using Microwave Doppler Radar (InTech) · 2012

Cited by 1Open access

Microchannel fabrication

Castillo Moreno, Claudia, Larsen, Tom · Infoscience (Ecole Polytechnique Fédérale de Lausanne) · 2017

In this project, we have studied a new microchannel fabrication technique based on the idea of the transference of a thin layer of Si3N4 on top of grooves to form channels. In order to do so, we have created two different wafers. The first of them was a silicon wafer with grooves. We have covered this wafer with Si3N4 and cut it into chips. The other one was a Si wafer covered with Si3N4 on one of its sides. The wafer is cut into chips and thinned down to a thickness of about 50 um. Both processes have been carried out at a clean room. The next steps have taken place in a laboratory. In this environment, we have etched the Si from the Si3N4 chips until we had a thin layer of Si3N4 and transfer this layer on the top of the chips with grooves. After analyzing the complete microchannel chips with the microscope, we have concluded that this process can be a good alternative to existing fabrication techniques.

Cited by 0Open access

Microchannel devices

Alman, David E., Wilson, Rick D. · University of North Texas Digital Library (University of North Texas) · 2001

The fabrication of stainless steel microchannel heat exchangers was examined through microlamination, the process of diffusion bonding precision machined metallic foils. The influence of diffusion bonding parameters, as well as the device geometry on the strength of the bond between the foils and embedded channel integrity, was investigated. During diffusion bonding, high temperatures and/or pressures result in well bonded foils, but these conditions cause the embedded channels to deform, which will degrade the efficiency of fluid flow through the channels. Alternatively, low temperatures and/or pressures result in undeformed channels but weakly bonded foils. This causes failure of the device due to fluid leakage. Thus, a processing envelope exists for producing a sound device with no fluid leakage and no degradation of fluid flow properties. The theoretical limit on aspect ratio within two-fluid counter-flow microchannel heat exchangers was also investigated. A counter-flow device is comprised of alternating layers of microchannels, which allow the two fluids to flow in opposite directions separated by fins. A theoretical model for interpreting the span of the fin as a function of the fin thickness was established. The model was verified experimentally by fabricating specimens to simulate the counter-flow device. The results of these investigations were used to aid in the design and processing of prototype microchannel devices.

Cited by 0Open access

microchannel plate

2024

Citation: 'microchannel plate' in the IUPAC Compendium of Chemical Terminology, 5th ed.; International Union of Pure and Applied Chemistry; 2025. Online version 5.0.0, 2025. 10.1351/goldbook.12489 • License: The IUPAC Gold Book is licensed under Creative Commons Attribution-ShareAlike CC BY-SA 4.0 International for individual terms. Requests for commercial usage of the compendium should be directed to IUPAC.

Cited by 0

Microchannel Plate

Masaki Nakazato, Takafumi Hirata · Journal of the Mass Spectrometry Society of Japan · 2021

Cited by 0Open access

Microchannel plates

B. Leskovar · Physics Today · 1977

For more than forty years researchers have applied the phenomenon of photoemission to convert absorbed incident radiation into an electron stream, which is then amplified by a secondary-emission process. The resulting fast high-gain photon detectors, such as photomultipliers and electron multipliers, are among the fastest and most sensitive devices for recording the collision of a photon (or electron, atom or energetic ion) with a target surface. These detectors have gained wide acceptance in research instrumentation, particularly in mass spectroscopy and scintillation spectroscopy, as well as in optical ranging and optical communication systems. Recently a new—faster, less noisy and more efficient—type of radiation detector has been developed, consisting of a plate traversed by a large number of microscopic channels that serve as electron multipliers.

Cited by 39

S3 Microchannel preparation

Nakielski, Paweł, Pawłowska, Sylwia · Figshare · 2017

The file include all steps necessary to prepare microchannel.<br><br>

Cited by 0Open access

Microchannel Heat Transfer

C. W. Liu, H. S. Ko, Chie Gau · Contact-less Assessment of In-vivo Body Signals Using Microwave Doppler Radar (InTech) · 2011

Cited by 1Open access