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About 10,000 papers for “Package development process”

Package on Package Module Assembly Process Development

Chuan Xia, Chengqun Gui, Scott Priore · SMTA International · 2014

ABSTRACT Package technology has been advanced significantly over the past several years, shifting from conventional components and direct board level assembly to chip or package level system integration. Two major commonly used approaches are System-on-Chip (SoC) and System-in-Package (SiP). Package-on-Package (PoP) that integrates processor in the bottom package and memory in the top package into a single 3D package is one of the promising SiP solutions. In addition to decreasing component pitch, utilization of the vertical space by stacking packages has found wide acceptance by electronic industry. Pb-free PoP technology represents one of the latest advancements in vertical electronics packaging integration and has become the preferred technology for mobile hand held electronics. All fine pitch components are assembled on the module and interconnected to the main board via BGA interface on the bottom of module in order to drive cost down by reducing the HDI interposer size and removing interface connectors. By changing the module top side and mother board designs, we can add more features and have more flexibility for products. It is not common for board level assembly factory to have capability of solder ball attachment process. Therefore, the work offers great technical challenges on optimizing process material and process parameters. It is also the first time for Cisco to assemble such fine pitch BGAs and develop solder ball attachment process. This paper describes process material selection, PoP module assembly process development and solder ball attachment process qualification. Detailed DOE and thermal cycle test have been carried out to verify assembly processes.

Cited by 0

Package on Package Module Assembly Process Development

Chuan Xia, Chengqun Gui, Scott Priore · Regional Events · 2014

ABSTRACT This paper is in English and Chinese languages. Package technology has been advanced significantly over the past several years, shifting from conventional components and direct board level assembly to chip or package level system integration. Two major commonly used approaches are System-on-Chip (SoC) and System-in-Package (SiP). Package-on-Package (PoP) that integrates processor in the bottom package and memory in the top package into a single 3D package is one of the promising SiP solutions. In addition to decreasing component pitch, utilization of the vertical space by stacking packages has found wide acceptance by electronic industry. Pb-free PoP technology represents one of the latest advancements in vertical electronics packaging integration and has become the preferred technology for mobile hand held electronics. All fine pitch components are assembled on the module and interconnected to the main board via BGA interface on the bottom of module in order to drive cost down by reducing the HDI interposer size and removing interface connectors. By changing the module top side and mother board designs, we can add more features and have more flexibility for products. It is not common for board level assembly factory to have capability of solder ball attachment process. Therefore, the work offers great technical challenges on optimizing process material and process parameters. It is also the first time for Cisco to assemble such fine pitch BGAs and develop solder ball attachment process. This paper describes process material selection, PoP module assembly process development and solder ball attachment process qualification. Detailed DOE and thermal cycle test have been carried out to verify assembly processes.

Cited by 0

Package on Package (POP) Process Development and Reliability Evaluation

Jonas Sjöberg, David Geiger, Todd Castello et al. · Pan Pacific Symposium · 2007

ABSTRACT Traditionally, most of the miniaturization for Printed Circuit Board Assemblies (PCBA) has been accomplished by stacking bare dies inside the package, reducing the pitch of the package, and/or reducing the component and pad spacing on the Printed Circuit Board (PCB). There is a limit, however, on what can be done with regards to component pitch and spacing. Package on Package stacking (PoP), offers a new alternative for further miniaturization and densification of PCBA. This paper describes the PoP process requirement in general, the impact on mechanical reliability using different pad layouts and with/without underfill.

Cited by 0

Package and Process Development of Molded Image Sensor Package

Alastair Attard, Jeffrey David Punzalan · 2025

Image sensors are experiencing significant proliferation across key application areas, including automotive Advanced Driver Assistance Systems (ADAS) and user experience enhancements, industrial automation and machine vision, and security/biometric identification. While ceramic packages have traditionally housed image sensors due to their favorable optical, thermal, and reliability characteristics, their high cost has driven a migration towards laminate-based packages like imaging Ball Grid Array (iBGA) to achieve more competitive price points and broaden image sensor adoption. However, the market's demand for higher resolution sensors necessitates larger image sensor die sizes, consequently leading to larger package dimensions that begin to test the reliability and mass production efficiency limits of conventional iBGA packages. This paper details the development of a new molded image sensor package, termed iBGAm, designed to address the requirements of larger package sizes with enhanced reliability. The iBGAm utilizes a film-assisted transfer molding process, demonstrating excellent package robustness, achieving extended AEC-Q100 Grade 2 reliability, and offering productivity benefits in high-volume manufacturing compared to the liquid encapsulation method of traditional iBGA packages. Key development challenges, including prevention of cover glass damage, wire sweep mitigation, warpage control, and avoidance of mold flash, were successfully addressed through material selection and process optimization using Design of Experiments (DoE). The iBGAm package, therefore, presents a viable and improved alternative for large, high-reliability image sensor applications.

Cited by 0

Process Development and Reliability Evaluation for Inline Package on Package (PoP) Assembly

Jonas Sjöberg, Todd Castello, David Geiger et al. · SMTA International · 2007

ABSTRACT Traditionally, most of the miniaturization for Printed Circuit Board Assemblies (PCBA) has been accomplished by stacking bare dies inside the package, reducing the pitch of the package, and/or reducing the component and pad spacing on the Printed Circuit Board (PCB). There is a limit, however, on what can be done with regards to component pitch and spacing. Package on Package stacking (PoP) offers a new alternative for further miniaturization and densification of PCBA. This paper describes the PoP process requirement, and the impact on mechanical and thermo mechanical reliability using different pad layouts and with/without underfill.

Cited by 0

Hyper BGA Package Assembly: Experimental Design and Process Development

Sunil Gopakumar, Rui Yang, Greg Wang et al. · SMTA International · 2025

ABSTRACT The increasing complexity of Ball Grid Array (BGA) packages, characterized by larger sizes and finer pitches, necessitates the development of advanced assembly processes to ensure robust yields. This paper addresses the challenges associated with assembling next-generation high performance computing hardware, focusing on lidless ASICs with large BGA packaging, high layer count asymmetrical Printer Circuit Board (PCB) stackups, and the difficulties faced by component package suppliers in controlling warpage. Design of Experiments (DOEs) was conducted to characterize these interactions and develop a reliable assembly process. The study focused specifically on large BGA packages integral to next-generation high performance computing (HPC) hardware platforms. Warpage measurement of BGA was done using the Shadow Moire technique, which simulates reflow temperatures to predict potential SMT process issues. PCB warpage was also characterized using the Shadow Moire technique on high layer count (>36 Layers) hybrid sequential laminated PCBs. The study revealed significant warpage in the packages can impact the SMT (Surface Mount Technology) yields. Experiments were conducted to understand the dynamic warpage characteristics of the PCB and package, gaining further insight into the issues. Process improvements including optimized stencil design, use of copper spacers as well as reflow profile changes, and optimizing SMT fixturing were carried out. The findings from the DOEs were applied to the subsequent build, resulting in a 100% SMT yield. This success was attributed to optimized stencil designs, copper spacers, and reflow temperature adjustments. Key takeaways from the experiments include the importance of close collaboration with Electronic manufacturers, engaging top-tier PCB vendors, and accurately characterizing dynamic warpage behavior. The DOE was instrumental in developing an advanced SMT process for challenging designs, providing a framework for future SMT development and qualification processes.

Cited by 0

Hyper BGA Package Assembly: Experimental Design and Process Development

Yu-Chen Liu · SMTA International · 2025

ABSTRACT Solder wettability is considered a crucial factor in determining the reliability of solder joints. It represents how liquid solder can be spread onto a base substrate material during the reflow process and form a robust bonding interface. Wettability is a function of solder composition, substrate material, and reflow temperature. Tailoring properties in the multi-component system with an experimental trial-and-error method is not economically feasible. Artificial intelligence methods have recently been pursued as a powerful tool to predict complex materials' properties including effective charge in electromigration effect, dielectric constant and dissipation factor in low temperature co-fired ceramics, irradiation embrittlement in steel, flank wear prediction in face milling of Inconel 718. This study utilizes the artificial intelligence method to develop a surrogate model fitted to experimental wetting angle data, aiming to predict the solder wettability. The model performance was characterized by using the cross-plot method and cross-validation methods. The model extrapolation to unknown alloys showed a good agreement with experimental data.

Cited by 0

Development of Package Software Test Process and Evaluation Module

Ha-Yong Lee · The KIPS Transactions PartD · 2003

패키지 소프트웨어는 그 특성상 동일한 유형에 속하는 다수의 제품 중에서 구매자가 적합하다고 판단되는 제품을 식별한 수 있어야 한다. 패키지 소프트웨어 제품에 대한 구매자의 선택 능력은 객관적인 품질 시험 절차와 방법을 통해 정해진 기준에 부합되는가를 판단할 수 있는 체계를 갖추고 있는가에 달려 있다. 이러한 체계를 구축하기 위해 패키지 소프트웨어에 적용할 수 있는 표준으로서 <ISO/IEC 14598-4 : 구매자를 위한 품질평가 프로세스>와 <ISO/IEC 12119 정보기술-소프트웨어 패키지-품진 요구사항 및 시험>이 있다. 본 연구에서는 이러한 표준을 기반으로 패키지 소프트웨어에 대한 품질시험 프로세스를 구축하고 시험 메트릭과 적용 방법을 개발함으로써 구매자가 효과적으로 자신의 요구에 맞는 패키지 소프트웨어론 선택할 수 있는 체계를 구축하였다. Package software should have the feature that enables purchasers to discriminate a product suitable for them among a number of software belonging to the similar kind of product. Purchaser's ability to choose a package software depends on whether they can judge that a package software conforms to the relevant standard through an objective quality test process and method or not. There are the standards that can be applicable to the quality evaluation of package software, such as <ISO/IEC 14598-4 : Qualify Evaluation Process for Acquirers> and <ISO/IEC 12119 : Information Technology-software package-Qualify Requirements & Test>. This study developed a system with which purchasers can effectively select a package software suitable for their needs, building quality test process for package software and developing test metric and application method.

Cited by 1Open access

Tender process of the Putrajaya 8MD3-infrastructure development package

Mohd Yazid, Nabihah · UiTM Institutional Repositories (Universiti Teknologi MARA) · 2022

Tender process seems to be very important because it provides an effective way for companies to examine whether they have the best supplier available for their specific needs, while also not prohibiting the reappointment of the incumbent supplier should that company be exclusive and out the best available to provide the services required. Tendering also an important stage because it must be completed properly in order for the company to win a bid, receive a letter of award, and accomplish the tender project. Therefore, this report will discuss about the tendering strategies.

Cited by 0

Assembly Process Development for a 14mmx14mm Bond Via Array (BVA) Package-On-Package (POP)

Shane Lewis, Tushar Tike, Charles Woychik et al. · SMTA International · 2015

ABSTRACT Package on Package (PoP) components offer a low cost, high performance solution for stacking of a logic device with memory. There are a number of challenges in the final assembly at the Electronic Manufacturing Services (EMS) facility. An assembly process has been developed for a Bond Via Array (BVA) PoP package having 14mm x 14mm body size with a topside memory module and a bottom logic module. In this PoP design, the solder ball interconnects between the top memory module and bottom logic module has 5 outer rows having 1020 I/O with a 0.24 mm pitch. The solder ball interconnects between the bottom logic module and the PCB is a patterned array having 916 I/O with a 0.4mm pitch. A special focus on this work was the optimization of the stacking process of the memory solder balls to make good interconnections to the BVA wires protruding from the bottom logic package. Topics covered for process evaluation will be vision systems, yield, package alignment and placement, voiding and major-defect identification such as bridging, opens-insufficient solder. Process issues related to solder volume, substrate coplanarity and x-ray inspection techniques will be presented. Finally design recommendations, reliability data and rework techniques will be reviewed.

Cited by 0

Development of low-cost and highly reliable wafer process package

Atsushi Kazama, T. Satoh, Y. Yamaguchi et al. · 2002

A wafer level chip-scale-package (WLCSP) is expected to reduce the manufacturing cost of CSPs, but reliability of a solder joint for a large chip size of about 100 mm/sup 2/ without underfill assembly is still in question. To meet this needs, we have developed a highly reliable and low-cost WLCSP named wafer process package phase 2 (WPP-2). The package includes a built-in stress-relaxation layer for reducing the strain of the solder bumps. To lower the manufacturing cost of the package, the stress-relaxation layer is formed by printing. The Young's modulus and the thickness of the stress relaxation layer were optimized by finite element analysis. The package was assumed to have 10/spl times/10 mm chip and 54 Sn-Ag-Cu solder balls of 400-/spl mu/m diameter placed as a grid array with the minimum pitch of 0.8 mm, and be mounted on a FR-4 motherboard. It was found that a thickness of 75-/spl mu/m and a Young's modulus of 1000 MPa are necessary for assuring no failure up to 1000 cycles under temperature cycling between -55 and 125/spl deg/C. Accordingly, a resin with a Young's modulus of about 1200 MPa at -55/spl deg/C was developed for the stress relaxation layer. High reliability of the simulated WPP-2 structure was confirmed by simplified test samples made of the developed resin. Fully processed WPP-2 samples were fabricated on an 8-inch wafer. The lifetime of the solder joints mounted on the FR-4 motherboard was evaluated by the temperature cycling test. The contact resistance of none of 50 samples increased by more than 20% even after 1400 cycles, and their lifetime to 50% failure was more than 3000 cycles.

Cited by 22

Development of Large RDL Interposer Package using RDL-first FOWLP Process

Soon Wee Ho, Siew Boon Serine Soh, Boon Long Lau et al. · 2023

In this work, an organic RDL interposer with large package size of 52 x 44 mm consisting of 12 embedded chiplets on a 60 x 60 mm organic substrate has been demonstrated using RDL-first FOWLP process. 2 field masks stitching was used to create the large interposer package size. 6 layers of high-density Cu RDL have been processed to meet the 12 chiplets interconnectivity and bandwidth performance requirements. Chiplets with micro-bumps were assembled on the RDL with a mass reflow process and encapsulated with mold compound thus forming the RDL interposer package. Electrical testing was conducted on the RDL test structures and the chiplets and results show good electrical continuity across the stitched Cu RDL traces and assembled chiplets. Shadow Moiré warpage measurement was performed on the RDL interposer package to characterize the warpage behavior during board assembly. The Shadow Moiré results show a large warpage change associated with the large RDL interposer during reflow process. A TCB technique was used to assemble the RDL interposer to the organic build-up substrate, to reduce the package warpage and enable the assembly of the RDL interposer to the organic substrate.

Cited by 0

Transfer pricing tool development process based on valve package production costs

Heikkinen, Riku Kalevi · LUTPub (LUT University) · 2003

Tämän diplomityön päätavoitteena oli parantaa kehitetyn kustannusperusteisen siirtohinnoittelutyökalun ominaisuuksia osastokohtaisen kustannusarviointiprosessin käyttöön. Työ on vaikeutunut lähimenneisyyden heikosta hintakyselyiden vastauskyvystä. Työn pääongelmana oli kerätä luotettavaa tuotannonohjausjärjestelmän kustannusaineistoa osittain vanhentuneista vakioventtiilien koneistus- ja materiaalitiedosta. Tutkimuksessa käytetyt tärkeimmät tutkimusmenetelmät voidaan jakaa siirtohinnoittelu- ja kustannusarvioprosessien kirjallisuustutkimukseen, kenttäanalyysiin ja nykyisen Microsoft Excel –siirtohinnoittelutyökalun kehittämiseen eri osastojen rajapinnassa. Siirtohinnoittelumenetelmät ovat yleisesti jaettu kustannus-, markkina- ja neuvotteluperusteisiin malleihin, jotka harvoin sellaisenaan kohtaavat siirtohinnoittelulle asetetut tavoitteet. Tämä ratkaisutapa voi johtaa tilanteisiin, jossa kaksi erillistä menetelmää sulautuvat yhteen. Lisäksi varsinaiseen siirtohinnoittelujärjestelmään yleensä vaikuttavat useat sisäiset ja ulkoiset tekijät. Lopullinen siirtohinnoittelumenetelmä tulisi ehdottomasti tukea myös yrityksen visiota ja muita liiketoiminnalle asetettuja strategioita. Työn tuloksena saatiin laajennettu Microsoft Excel –sovellus, joka vaatii sekä vuosittaista että kuukausittaista erikoisventtiilimateriaalien hinta- ja toimitusaikatietojen päivittämistä. Tämä ratkaisutapa ehdottomasti parantaa kustannusarviointiprosessia, koska myös alihankkijatietoja joudutaan tutkimaan systemaattisesti. Tämän jälkeen koko siirtohinnoitteluprosessia voidaan kehittää muuntamalla kokoonpano- ja testaustyövaiheiden kustannusrakennetta toimintoperustaisen kustannuslaskentamallin mukaiseksi.

Cited by 0

3D wafer level compression molding process development for image sensor package

Shuying Ma, Mengqiang Li, Zhiyi Xiao et al. · 2017

For CMOS image sensors (CIS), automotive application is a very big market. However, it is quite difficult for the package especially WLCSP to pass the automovive reliability requirement. In this paper, a highly reliable wafer level image senor packaging technology using wafer level molding process was reported. Various related materials and process such as die to wafer attach, compression molding, de-flash, laser dicing are investigated. The controlling of the exposure height of the solder balls after molding process is a big challenge since it may have relationship with release film material, molding parameters, ball pitch and ball diameter. Experimental for warpage reduction, chip crack prevention, and residue cleaning on solder ball by de-flash process are carried out. Reliability tests based on JEDEC standard are carried out to study the package reliability. The results show there is no failure for the test samples using present package structure.

Cited by 5