Failure Analysis
Alan Ruby, Robert Boruch · Scholarly Commons (University of Pennsylvania) · 2013
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About 10,000 papers for “failure analysis”
Alan Ruby, Robert Boruch · Scholarly Commons (University of Pennsylvania) · 2013
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John C. Lippold · 2014
This chapter discusses the importance and application of fractography, and presents a simple guide for conducting a failure investigation. It provides examples of fracture surfaces that are characteristic of the different forms of weld cracking: solidification cracking, liquation cracking, reheat cracking, and strain-age cracking. The chapter further provides an overview of how a failure investigation should be conducted, including techniques and approaches to obtain the information needed to determine the cause of failure to a reasonable degree of engineering and scientific certainty. The sequence of investigative steps may vary depending on the nature of the failure, but in general, all of the 17 items on this checklist should be considered during the course of the investigation. The chapter provides additional insight regarding these items.
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IEEE Transactions on Reliability · 1980
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James F. Shackelford · The electrical engineering handbook/Electrical engineering handbook series/Electrical engineering handbook · 2004
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Domenico Pagliaro · University of Klagenfurt
Failure Analysis (FA) uses combinations of a multitude of methods to identify and localize failures in semiconductor devices. The performance or efficiency of a FA lab is often measured by throughput or the total time needed to complete an analysis. These KPIs (Key Performance Indicators) can be optimized, but sequences of executed methods might be long and, therefore, hard to understand and optimize. Processes executed in an ad hoc manner might block each other causing long queues for specific tools and overloading specialists working with them. These and other factors can lead to a significant decrease in lab performance. Identifying and locating non-conformities, such as physical failures causing electrical malfunctioning of a device, in modern semiconductor devices is a challenging task. Typically, highly qualified employees in a failure analysis (FA) lab use sophisticated and expensive tools like scanning electron microscopes to identify and locate such non-conformities. Given the increasing complexity of investigated devices and very limited resources, labs may struggle to deliver analysis results in time. This thesis presents a novel approach to analyzing FA processes with a focus on Internal Physical Inspection (IPI) jobs and to optimize the usage of FA lab resources by adaptive scheduling and monitoring. Specifically, we use machine learning and statistical methods to estimate (a) the workflow that engineers follow while completing IPI jobs and (b) the duration of each operation executed in the workflow. Our approach starts with data extraction and preprocessing, aiming at extracting features characterizing the workflow, like the package or technology of a sample, as well as providing information about the complexity of each task, thus, allowing us to predict their duration. The resulting tool allows lab management and team leads to analyze the execution of IPI jobs and optimize them. Moreover, the information provided by the tool can be used in automated scheduling methods providing recommendations to FA engineers about sequences of jobs improving utilization of the lab’s resources. Then, we combine constraints programming for the computation of a schedule with stream reasoning to monitor the lab’s conditions and maintain the schedule depending on the situation. Evaluation results indicate that our system can significantly improve the tardiness of a real-world FA lab, and all its computational tasks can be finished in an average time of 3.6 seconds, with a maximum of15.2 seconds, which is acceptable for the lab’s workflows.
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T. Tinga · RePEc: Research Papers in Economics
Abstract This chapter discusses methods that can be applied in the analysis of failures. Existing methods are discussed, and an integrated approach based on utilizing the knowledge on loads and failure mechanisms is introduced. The method is demonstrated on a real case study. After the treatment of the analysis methods, background information and procedures to assist in assessing the failure mechanism of a failure at hand will be provided.
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Jaroslav MenÄÃk · Contact-less Assessment of In-vivo Body Signals Using Microwave Doppler Radar (InTech) · 2016
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A.G. Evans, D.W. Richerson · Elsevier eBooks · 1991
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Hiyam Farhat · Elsevier eBooks · 2021
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Ş. Hakan Atapek · Kocaeli Üniversitesi - AVESİS · 2020
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ŞEYDA POLAT, Ş. Hakan Atapek · Kocaeli Üniversitesi - AVESİS · 2015
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Zheng Zhang, Xuechao Chen, Yongchao Ma et al. · 2016
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Ş. Hakan Atapek · Kocaeli Üniversitesi - AVESİS · 2021
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Ruby, Alan, Boruch, Robert · Scholarly Commons (University of Pennsylvania) · 2013
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Q. Jane Wang, Yip-Wah Chung · 2013
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Mechanics of Materials · 2025
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Past Year Exam Question · UTPedia (Universiti Teknologi Petronas) · 2022
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Hiroshi Shiomi · Journal of the Japan Society for Precision Engineering · 1991
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Qingmei Wang, Peng Shi · 2009
Failure cases are very important for failure analysis. So how to deduce the failure mode of a new failure case based on existed failure cases will be discussed in this file. Firstly, according to the collection of large accident case, summarized how to deduce the failure features and failure information of each failure modes may have. Then identify the possibilities of the new failure case belong to each kind of existing failure mode, using the fuzzy identification method put forward in this paper. And then judge which failure mode the failure case is most likely belongs to.
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W. Workman · Physics of failure in electronics · 1964
THE PHYSICS OF FAILURE effort must bring about a thorough understanding of the causes of device malfunction which then must be used to generate changes in the overall production and control techniques. Texas Instruments Failure Analysis Laboratory has developed a generalized routine for transistor failure analysis and is developing one for integrated microelectronic circuits. The resulting information is relayed to other responsible groups to attempt to prevent recurrence. Principal failure modes and analysis techniques are illustrated by charts.
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