Skip to content
Free planNo credit card requiredStart writing
AI for Research home
AI for Research home
Dashboard
Sign inGet started

article · 2002

The impact of miniaturization and passive component integration in emerging MCM applications

Y.L. Low, R.C. Frye

Cited by 15Abstract and details only

Abstract

We have designed multichip modules using three alternative technologies for a variety of applications, and have used the results to study the impact of miniaturization and passive component integration on module size, distribution of net length and estimated cost. We have chosen representative applications that include: a digital application with dense interconnections, a mixed-signal application for low-end portable electronics and an analog application requiring a large number of passive components. We compare conventional, laminate-based MCM technology with advanced thin-film-on-laminate technology and silicon-based thin-film MCM technology. We find that the advanced highly miniaturized technologies result not only in higher packaging density and shorter average net length, but in lower estimated module cost as well. Passive component integration can also lower module cost especially in mixed-signal and analog applications.

Cite this paper

APA 7

Low, Y., & Frye, R. (2002). The impact of miniaturization and passive component integration in emerging MCM applications. https://doi.org/10.1109/mcmc.1997.569341

MLA 9

Low, Y.L., and R.C. Frye. “The impact of miniaturization and passive component integration in emerging MCM applications.” 2002, pp. 27–32, https://doi.org/10.1109/mcmc.1997.569341.

Chicago

Low, Y.L., and R.C. Frye. 2002. “The impact of miniaturization and passive component integration in emerging MCM applications.” https://doi.org/10.1109/mcmc.1997.569341.

Harvard

Low, Y. and Frye, R. (2002) ‘The impact of miniaturization and passive component integration in emerging MCM applications’. Available at: https://doi.org/10.1109/mcmc.1997.569341.

BibTeX
@article{low2002impact,
  title = {{The impact of miniaturization and passive component integration in emerging MCM applications}},
  author = {Low, Y.L. and Frye, R.C.},
  pages = {27--32},
  year = {2002},
  doi = {10.1109/mcmc.1997.569341}
}

Made from the index record. Check names, capitalisation and page numbers against the paper. Need another style? AI for Research has over 10,000.

Related papers