Interconnection technology

Abstract

A project was conducted to develop interconnection techniques for application to present and future electronic assemblies--especially those using hybrid microcircuits (HMCs). Project work included: (1) determination of the relative costs of welding opposed to the soldering of HMC packages; (2) evaluation of the solderability of thin films including definition of solderability tests; (3) establishment of a thermocompression (TC) bonding schedule to attach gold plated copper leads to thin film gold conductors; (4) determination of relative assembly times for Ampere sockets and bifurcated terminals to interconnect ceramic substrates; (5) determination of a means of interconnecting stacked, open-faced substrates within tight packaging restraints and demonstrating its feasibility by fabricating a model; (6) evaluation of a flexible circuit to replace a problem printed circuit board for enhancement of visual inspection of solder joints; and (7) development of a process to reflow solder, in a single operation, all or half of the ribbon leads from an integrated circuit (IC) or HMC package to a printed circuit board (PCB).

Cite this paper

@article{beck1976interconnection,
  title = {{Interconnection technology}},
  author = {Beck, W.P. and Sim, Jae-Woo},
  journal = {University of North Texas Digital Library (University of North Texas)},
  year = {1976},
  doi = {10.2172/7148242}
}

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