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About 10,000 papers for “Interconnection”

Interconnection

Sushil Jajodia, Pierangela Samarati, Moti Yung · 2025

Cited by 0

Interconnection

Leger, Nixon · Digital Commons (Providence College) · 2016

Cited by 0Open access

Interconnection

Katsuaki Suganuma · Springer briefs in electrical and computer engineering · 2013

Cited by 0

Interconnection

Cranston, R., Financial Times Telecommunications and Media Publishing, London (United Kingdom) · OpenGrey (Institut de l'Information Scientifique et Technique) · 1997

Cited by 0

Interconnection

Snucl An Opencl, Jaejin Lee, China Workshop et al. · 2012

Cited by 0

Interconnection

Costas Courcoubetis, Richard Weber · 2003

This chapter contains sections titled: The Market Structure Competition and Service Differentiation Incentives for Peering Incentive Contract Issues Modelling Moral Hazard Further Reading

Cited by 0

Interconnection Network

David Coudert, Afonso Ferreira, Xavier Munoz et al. · 2009

HAL is a multi-disciplinary open access archive for the deposit and dissemination of sci-entific research documents, whether they are pub-lished or not. The documents may come from teaching and research institutions in France or abroad, or from public or private research centers. L’archive ouverte pluridisciplinaire HAL, est destinée au dépôt et a ̀ la diffusion de documents scientifiques de niveau recherche, publiés ou non, émanant des établissements d’enseignement et de recherche français ou étrangers, des laboratoires publics ou privés.

Cited by 0

Interconnection technology

W.P. Beck, Jae-Woo Sim · University of North Texas Digital Library (University of North Texas) · 1976

A project was conducted to develop interconnection techniques for application to present and future electronic assemblies--especially those using hybrid microcircuits (HMCs). Project work included: (1) determination of the relative costs of welding opposed to the soldering of HMC packages; (2) evaluation of the solderability of thin films including definition of solderability tests; (3) establishment of a thermocompression (TC) bonding schedule to attach gold plated copper leads to thin film gold conductors; (4) determination of relative assembly times for Ampere sockets and bifurcated terminals to interconnect ceramic substrates; (5) determination of a means of interconnecting stacked, open-faced substrates within tight packaging restraints and demonstrating its feasibility by fabricating a model; (6) evaluation of a flexible circuit to replace a problem printed circuit board for enhancement of visual inspection of solder joints; and (7) development of a process to reflow solder, in a single operation, all or half of the ribbon leads from an integrated circuit (IC) or HMC package to a printed circuit board (PCB).

Cited by 1Open access

Interconnection reliability

B.T. Reagor · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1988

Presents a summary of some of the key features that can affect interconnection reliability. In particular, addresses how manufacturing contamination, materials selection, lubrication, and environmental protection affect all levels of interconnection. The information is documented through discussion of actual field failures.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">&gt;</ETX>

Cited by 0

Interconnection Networks

Michel Dubois, Murali Annavaram, Per Stenström · 2025

Teaching fundamental design concepts and the challenges of emerging technology, this textbook prepares students for a career designing the computer systems of the future. Self-contained yet concise, the material can be taught in a single semester, making it perfect for use in senior undergraduate and graduate computer architecture courses. This edition has a more streamlined structure, with the reliability and other technology background sections now included in the appendix. New material includes a chapter on GPUs, providing a comprehensive overview of their microarchitectures; sections focusing on new memory technologies and memory interfaces, which are key to unlocking the potential of parallel computing systems; deeper coverage of memory hierarchies including DRAM architectures, compression in memory hierarchies and an up-to-date coverage of prefetching. Practical examples demonstrate concrete applications of definitions, while the simple models and codes used throughout ensure the material is accessible to a broad range of computer engineering/science students.

Cited by 0

Interconnection Reliability

B. Reagor · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1988

Presents a summary of some of the key features that can affect interconnection reliability. In particular, addresses how manufacturing contamination, materials selection, lubrication, and environmental protection affect all levels of interconnection. The information is documented through discussion of actual field failures.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">&gt;</ETX>

Cited by 0