article · ACM SIGARCH Computer Architecture News · 2003

Temperature-aware microarchitecture

Kevin Skadron, Mircea R. Stan, Wei Huang, Sivakumar Velusamy, Karthik Sankaranarayanan, David Tarjan

Cited by 317Abstract and details only

Abstract

With power density and hence cooling costs rising exponentially, processor packaging can no longer be designed for the worst case, and there is an urgent need for runtime processor-level techniques that can regulate operating temperature when the package's capacity is exceeded. Evaluating such techniques, however, requires a thermal model that is practical for architectural studies.This paper describes HotSpot, an accurate yet fast model based on an equivalent circuit of thermal resistances and capacitances that correspond to microarchitecture blocks and essential aspects of the thermal package. Validation was performed using finite-element simulation. The paper also introduces several effective methods for dynamic thermal management (DTM): "temperature-tracking" frequency scaling, localized toggling, and migrating computation to spare hardware units. Modeling temperature at the microarchitecture level also shows that power metrics are poor predictors of temperature, and that sensor imprecision has a substantial impact on the performance of DTM.

Cite this paper

APA 7

Skadron, K., Stan, M. R., Huang, W., Velusamy, S., Sankaranarayanan, K., & Tarjan, D. (2003). Temperature-aware microarchitecture. ACM SIGARCH Computer Architecture News, 31(2), 2–13. https://doi.org/10.1145/871656.859620

MLA 9

Skadron, Kevin, et al. “Temperature-aware microarchitecture.” ACM SIGARCH Computer Architecture News, vol. 31, no. 2, 2003, pp. 2–13, https://doi.org/10.1145/871656.859620.

Chicago

Skadron, Kevin, Mircea R. Stan, Wei Huang, Sivakumar Velusamy, Karthik Sankaranarayanan, and David Tarjan. 2003. “Temperature-aware microarchitecture.” ACM SIGARCH Computer Architecture News 31 (2): 2–13. https://doi.org/10.1145/871656.859620.

Harvard

Skadron, K. et al. (2003) ‘Temperature-aware microarchitecture’, ACM SIGARCH Computer Architecture News, 31(2), pp. 2–13. Available at: https://doi.org/10.1145/871656.859620.

BibTeX

@article{skadron2003temperature,
  title = {{Temperature-aware microarchitecture}},
  author = {Skadron, Kevin and Stan, Mircea R. and Huang, Wei and Velusamy, Sivakumar and Sankaranarayanan, Karthik and Tarjan, David},
  journal = {ACM SIGARCH Computer Architecture News},
  volume = {31},
  number = {2},
  pages = {2--13},
  year = {2003},
  doi = {10.1145/871656.859620}
}

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