article · 2010
On-chip em-sensitive interconnect structures
Dian Li, Malgorzata Marek-Sadowska, Bill Lee
Cited by 2Abstract and details only
Abstract
Due to ever greater current densities in modern IC designs, electromigration (EM) in copper interconnects has become an important reliability factor. In this paper, we analyze current densities on bus and clock networks. We observe that under certain conditions, these networks may become sensitive to EM effects and prone to failure. We perform SPICE simulations on open source Wishbone bus and non-tree clocks for IBM and ISCAS89 benchmarks. Experiments on these networks show that on some wire segments current may flow predominantly in one direction and its density may exceed the maximum allowed values suggested by the International Technology Roadmap for Semiconductors (ITRS). When power network experiences noise, the links of a non-tree clock may carry currents whose densities could be 100 times greater than those of the tree branches. In our study, we compare various methods of reducing the EM effect on interconnects. We demonstrate that in comparison to such design methods as increasing wire widths, reducing circuit frequency or decreasing driver sizes, the technology-based solution of capping copper (Cu) wires with cobalt tungsten phosphide (CoWP) coating works best and eliminates EM violations without area overhead, performance loss or additional design effort.
Cite this paper
Li, D., Marek-Sadowska, M., & Lee, B. (2010). On-chip em-sensitive interconnect structures. https://doi.org/10.1145/1811100.1811112
Li, Dian, et al. “On-chip em-sensitive interconnect structures.” 2010, pp. 43–50, https://doi.org/10.1145/1811100.1811112.
Li, Dian, Malgorzata Marek-Sadowska, and Bill Lee. 2010. “On-chip em-sensitive interconnect structures.” https://doi.org/10.1145/1811100.1811112.
Li, D., Marek-Sadowska, M. and Lee, B. (2010) ‘On-chip em-sensitive interconnect structures’. Available at: https://doi.org/10.1145/1811100.1811112.
@article{li2010chip,
title = {{On-chip em-sensitive interconnect structures}},
author = {Li, Dian and Marek-Sadowska, Malgorzata and Lee, Bill},
pages = {43--50},
year = {2010},
doi = {10.1145/1811100.1811112}
}Made from the index record. Check names, capitalisation and page numbers against the paper. Need another style? AI for Research has over 10,000.