article · 2015

interconnect structures under electromigration stress

Roberto Lacerda, Orio Hajdin Ceric, Siegfried Selberherr

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Abstract

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Cite this paper

APA 7

Lacerda, R., Ceric, O. H., & Selberherr, S. (2015). interconnect structures under electromigration stress.

MLA 9

Lacerda, Roberto, et al. “interconnect structures under electromigration stress.” 2015.

Chicago

Lacerda, Roberto, Orio Hajdin Ceric, and Siegfried Selberherr. 2015. “interconnect structures under electromigration stress.”

Harvard

Lacerda, R., Ceric, O.H. and Selberherr, S. (2015) ‘interconnect structures under electromigration stress’.

BibTeX

@article{lacerda2015interconnect,
  title = {{interconnect structures under electromigration stress}},
  author = {Lacerda, Roberto and Ceric, Orio Hajdin and Selberherr, Siegfried},
  year = {2015}
}

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